DIE BONDER / DIE SORTER
Ever since the opening of the first BIM line in 1987 (Breakthrough In Manufacturing), ITEC has been committed to incorporate the latest technologies and process expertise into tailored solutions. Enabling our customers to excel in quality, productivity and sustainability with the lowest total cost of ownership.
30 YEARS AT THE FRONTLINE OF ASSEMBLY AND TESTING
Semiconductor-based electronic systems have transformed our world. The result is a constant pressure to pack more functionality into smaller, compact footprints in ever higher quantities. In addition, high-volume developments like RFID labels and mini LED displays require new package materials and processes. It's only with proven, high-quality, sustainable volume assembly and test operations, that this becomes commercially feasible. To truly deliver the efficiencies needed to assemble and test high-volume, high-quality semiconductors at low cost, requires both technical expertise and manufacturing insight. ITEC combines state-of-the-art equipment and automation expertise with 30 plus years of semiconductor manufacturing experience as an equipment and automation partner (Philips, NXP, Nexperia).
NIJMEGEN, THE NETHERLANDS
As ITEC’s HQ and primary R&D site, Nijmegen plays a vital role for ITEC and particularly our die sort & attach, testing and automation developments. The city has also evolved to be a leading center of health and high-tech innovation, allowing ITEC to draw on the region’s advanced mechatronics, process engineering and smart manufacturing capabilities.
ITEC Asia is located in the innovative environment of Hong Kong Science and Technology Park, the flagship of technolgy infrastructure in Hong Kong. From here we drive our R&D on inspection systems and run the service and supply chain organization.