Target segments
Back-end final test
Wafer Test
High performance
Handler and prober agnostic
Multi-site testing
1 to 4 handlers
Short test times*
Pin electronics (voltage and current measurement on all pins simultaneously)
Maximum number of pins: (FT and AT/QT): 6 or 12 pins
High-quality diagnostics and calibration
High accuracy*
Test heads
Current amplifier for fast leakage measurement
Short and open pins close to DUT
Dedicated test hardware
Embedded software
User-definable parameters
Visual ITEC: user-definable operator interface
Automatic multi-site expansion
Scope function
V and I waveforms and timing on all channels
Real-time diagnostics
Curve traces
Extendable software
Equipment control for multiple test cells
Post-processing
Dynamic part average test
Static part average test
Moving limits
Nearest neighbourhood residual
Extreme flexibility options:
µPFM: floating mV meter (30 mV / 300 mV / 3 V)
DCM: digital capacitance meter (0.3 / 3 / 30 / 300 pF)
µMUX: multiplexer 4 x 24 pins for multi-site test
DIE BONDER / DIE SORTER
Eliminates lengthy test times
Gain short tester times and increase production at a lower total cost of ownership. Built as a modular parameter test system for discrete semiconductor devices with up to 12 leads, the Discrete High-Volume Tester enables high throughput. Flexible hardware and software make the Tester suitable for all wafer testing, final testing, acceptance or quality testing, and device characterization tasks. µPARSET software gathers data about measured devices and produces various insights. It is handler and prober agnostic, equipped to connect to any prober or tester. High accuracy leads to a narrow spread in test results and better products. It can connect up to four handlers when floor space is limited.
Maximum supply and current per channel:
400 V / 3 A
Small footprint:
600 x 665 x 1235 mm
Other
Extendable test heads for adding handlers (max 4)
Maximum: 12 leads
Voltage: 220 - 240 VAC +/- 5%, 1-phase
Current: Fused on 16 A
Frequency: 50 / 60 Hz +/- 0.5 Hz
Handler interface: GPIB, TTL, RS232, TCP/IP
Optional SECS/GEM interface following SEMI standard
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