For a fully automated, hands-off operation to increase your uptime and output

The Reel-to-Reel Eutectic Die Bonder supports all wafer map formats and is designed with high-definition optics for small-to-medium discrete products at extreme speed. With die alignment, backside chipping, die size measurement, and optional sidewall inspection for flat collets, the ADAT3 XF DBRE guarantees to enhance your production, product quality, and total cost of ownership.

ADAT3-DBRE-XF-1
KEY FEATURES
SPECIFICATIONS
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KEY FEATURES

Post-attach inspection:
Die present
Lead frame alignment XY
Black die detection
Surface inspection as a roadmap element.

Wafer handling:
Auto wafer change
Wafer expansion
Auto barcode reader
Extensive wafer mapping and wafer alignment functionality

Automation
Wafer map formats: Market standards. Full wafer map
Wafer map alignment: Start and reference die functionality.
Auto equipment setup: via Semiconductor Equipment Communication Standard (SECS) / Generic Equipment Model (GEM)
Traceability: ID input by barcode scanning

Connectivity
Connectivity via Semiconductor Equipment Communication Standard (SECS) / Generic Equipment Model (GEM) for automated set-up and die traceability
Automatic FFC wafer change for hands-off operation (AEC-Q101 compliant)
Flexible platform for all applications
Fits in XF (Extended Flexibility) platform architecture reel-to-reel lines
Convertible to other XF (Extended Flexibility) applications for leaded and leadless to cater for product mix flexibility
Optional lead frame, anti-tarnish, outgassing module.

SPECIFICATIONS

Speed
48.000 dies per hour with roadmap to 60.000 dies per hour for small dies (≤ 0.4 x 0.4 mm)

Product size
200 x 200 um to 5 x 5 mm

Lead frame size
up to 32 mm wide

System accuracy
Small die (≤ 0.4 x 0.4 mm)
XY: 1 σ_xy ≤ 10 μm
Rotation: 1 σ_φ ≤ 1˚

Wafer handling
Wafer diameter: 8 inches, 6 inches on 8 inches Film Frame Carrier (FFC)
Wafer frame: Steel Film Frame Carrier (FFC) 8 inches or 12 inches
Foil tension: 8 inches, 1 - 10 mm
Wafer cassette: up to 25 slots

Die handling
Process Temperature: maximum 470 °C
Pickup force: 0.4 - 1.5 N ±0.1 N, Ultra-low (programmable) pickup force (20 grams)
Bond force: 0.2 - 1.5 N ±0.1 N
Mixed gas: customer-specific
Collet: pyramidal, flat
Ejector tool: single needle

Machine dimensions
Machine length, width, height: 2050 x 1250 x 2200 mm3
Net weight: 1850 kg

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