Post-attach inspection:
Die present
Lead frame alignment XY
Black die detection
Surface inspection as a roadmap element.

Wafer handling:
Auto wafer change
Wafer expansion
Auto barcode reader
Extensive wafer mapping and wafer alignment functionality

Automation
Wafer map formats: Market standards. Full wafer map
Wafer map alignment: Start and reference die functionality.
Auto equipment setup: via Semiconductor Equipment Communication Standard (SECS) / Generic Equipment Model (GEM)
Traceability: ID input by barcode scanning

Connectivity
Connectivity via Semiconductor Equipment Communication Standard (SECS) / Generic Equipment Model (GEM) for automated set-up and die traceability
Automatic FFC wafer change for hands-off operation (AEC-Q101 compliant)
Flexible platform for all applications
Fits in XF (Extended Flexibility) platform architecture reel-to-reel lines
Convertible to other XF (Extended Flexibility) applications for leaded and leadless to cater for product mix flexibility
Optional lead frame, anti-tarnish, outgassing module.