Up to 60.000 units per hour

Eliminate the trade-off between quality and productivity with high-definition inspection executed on the fly without any speed penalty. At four times faster than anything on the market, this is the industry’s leading strip-to-strip die bonder for leaded or leadless packages with glue or DAF/WBC applications. The ADAT3 XF DBSG eliminates manual wafer change and speed drop, plus is capable of handling die as small as 0.2 x 0.2 mm.


Up to 60.000 units per hour
Supports 8 to 12 inches wafer on frame film carrier

Strip size
100 x 300 mm

Die size
Minimal: 0.2 x 0.2 mm
Maximum: 5 x 5 mm
High throughput at high-volume manufacturing rate
4 cassettes at output or optional at input autoloader
Full die traceability (strip E142 – wafer)
Auto recipe download (MES interface)
SECS/GEM interface with E142
QFN, DFN, HVQFN, SOT, SO, TSSOP, LGA leadless and leaded packages


Up to 60.000 units per hour, depending on die size, lead frame pitch, glue type and selected quality inspections

Die Range
Length, width: 0.2 x 0.2 mm to 5 x 5 mm
Aspect Ratio: 1:1 - 1:3
Thickness: 50 - 400 um

Lead frame size
Minimum length, width: 100 x 40 mm
Maximum length, width: 300 x 100 mm
Thickness: 0.1 - 1.0 mm

System accuracy
Small die (≤ 1 mm): XY: 1 σ xy ≤ 5 μm. Rotation: 1 σ φ ≤ 1˚
Large die (> 1 mm): XY: 1 σ xy ≤ 5 μm. Rotation: 1 σ φ ≤ 0.3˚
Pick and place force: 0.2 - 1.5 ± 0.1 N

Pick up tooling
Vespel collet
Rubber tip
Four-sided collet
Push-up needle

Wafer handling
Wafer size: 6 - 12 inches
Wafer frame: 8 - 12 inches
Steel/Plastic Film Frame Carrier (FFC)
Foil Tension: Programmable expander (8 inches: 1-10 mm; 12 inches: 1 - 15 mm)
Automatic wafer change and expander
Automatic barcode reader

Lead frame handling
Stack loader including paper separation
Magazine loader/unloader: Maximum 4 magazines at load and unload 20 - 40 slots per
Magazine size: Minimum length, width, height: 100 x 45 x 80 mm
Maximum length, width, height: 305 x 110 x 270 mm

Twin cross writing module, volumetric dispense
Dot/Cross size, resolution: ≥ 250 um 1 σ 10 µm
Dot/Cross position: 1 σ ≤ 20 µm

Imaging system
Number of cameras: 4
Resolution/Field of View (FOV) glue: 0.3 MP camera (3.2 UM/pixel), FOV 2.1 x 1.4 mm
Resolution/ Field of View (FOV) pick-up and backside: 5.0 MP camera (2.3 UM/pixel), FOV 5.6 x 4.7 mm
Resolution/ Field of View (FOV) post-bond: 5.0MP camera (4.6 UM/pixel), FOV 11.3 x 9.4 mm
Resolution/ Field of View (FOV) sidewall: optional
Minimal object detection: 10 micrometres (μm)
Lighting: coaxial and ring light, including multicolour light

Inspection categories
Program mode: Fast programming for common reject criteria
Reject treatment: Strip map (E142) and reject bin
Inspection view: 4 cameras, (1) glue, (2) pre pick, (3) back, (4) post-bond

Inspection items
Die-related: Top chipping, backside chipping. Damaged. Die size/die ratio. Scratch. Cracked die. Discoloration
Glue-related: Drop size. Drop shape
Post-bond related: Die alignment (position, size, rotation). Glue fillet

Wafer map SEMI E142 format, SECS-GEM MPA exchange
Start and reference die functionality
Automatic Product Replacement
MES Interface including auto recipe download
Monitoring of critical process parameters during production. Automatic stop function when parameter out of control
Servo, bond-force and vacuum auto-diagnostics functionality to check health status of the machine

Machine dimensions
Length, width, height: 3000 x 2100 x 1250 mm3 (without magazine loader)
Length, width, height: 3500 x 2100 x 1250 mm3 (with magazine loader)
Net weight: 3000 kg (without magazine loader)
Net weight: 3300 kg (with magazine loader)

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