Performance
Up to 60.000 units per hour
Supports 8 to 12 inches wafer on frame film carrier
Strip size
100 x 300 mm
Glue/DAF/WBC
Die size
Minimal: 0.2 x 0.2 mm
Maximum: 5 x 5 mm
High throughput at high-volume manufacturing rate
4 cassettes at output or optional at input autoloader
Full die traceability (strip E142 – wafer)
Auto recipe download (MES interface)
SECS/GEM interface with E142
QFN, DFN, HVQFN, SOT, SO, TSSOP, LGA leadless and leaded packages