Application
Inspection of lead-frame substrate to detect package dimension, molding and plating defect
Key features
Dual stations for 2D inspection and laser marker
Throughput: 32K to 117K UPH (subject to package size & leadframe density)
Support max 100 mm x 300 mm substrate LF size
8K or 16K line scan camera resolution
3-4 magazines for on/off loaders
Auto-lead frame QR code reading
Full strip laser mark option
Vacuum system and brush clean for package laser mark
AOI cellular network architecture for recipe and e-Map management
Option: real-time data feeding to MES and eSPC
Option: auto email alert (defect / batch summary)
SEMI standard with SECS/GEM interface
Advanced Defect Classification (ADC) by deep learning