DIE BONDER / DIE SORTER
ITEC combines deep-core insight and three decades of experience to translate your challenges into advantages on semiconductor assembly and testing. Our technical expertise results in the most advanced mechatronic systems, extremely fast and accurate testers, inspection algorithms and smart manufacturing solutions.
ITEC’s ADAT3 platform is one of the most productive die attach solutions for low-cost / high-volume electronics assembly. End-applications range from semiconductor Back-End to LED display and RFID-inlay manufacturing. The system can be easily converted from flip to non-flip applications. Depending on the substrate, ADAT3 is tailored to Strip-to-Strip, Reel-to-Reel, Panel or Web substrates, supporting glue or eutectic bonding processes.
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