ITEC has the world’s fastest range of accurate die bonders and sorters for mass-produced semiconductor devices, and that includes dedicated bonders for RFID inlays and LED Displays. Our solutions include strip-glue and eutectic platforms.
WHAT SETS OUR DIE ATTACH SOLUTIONS APART?
Multiple cameras at key process points help keep operation under close control. The machines perform high definition (up to 5 megapixel) inspections without sacrificing speed. XY accuracy is below 5 microns, which is increasingly important as die and feature sizes continue to shrink.
Systems are equipped with automatic wafer change for up to 300 mm wafers and comply with SECS/GEM and MES interface standards. Operating costs are further reduced by inbuilt versatility. We label all our ADAT3 machines XF (eXtra Flexible), because they can perform, in various applications – reel-to-reel, strip-to-strip and other types of die attach/bond – simply by reconfiguring them. So, you don't need to buy another machine when your or your customer’s requirements change.
Click on one of the product types below to learn more.