Latest news and events

March 21, 2024

Meet ITEC at these conferences in 2024

In a testament to its commitment to innovation and industry leadership, ITEC is gearing up for a bustling year of networking, learning, and collaboration as it prepares to participate in four major conferences in 2024. These events will not only provide a platform for showcasing the company's latest advancements but also offer opportunities for knowledge exchange and strategic partnerships.

December 18, 2023

ITEC brings semiconductor manufacturing to RFID tag production

Martijn Zwegers, product director, joined ITEC at the end of 2022 to take on responsibility for the company’s high tech die-attach machines, including the Tagliner for RFID inlays. He has worked in the semiconductor industry for nearly 20 years, holding positions with major manufacturers of equipment for the back-end semiconductor industry.

November 15, 2023

ITEC introduces the industry’s fastest and most accurate RFID inlay die bonder

ITEC’s ADAT3 XF Tagliner is the industry’s fastest and most accurate RFID inlay die bonder. Featuring placement speeds of up to 48,000 Units Per Hour (UPH), with positional and rotational accuracies better than 9 microns and 0.67º at 1 sigma, it is three times faster and 30% more accurate than other die bonding equipment.