What sets our die attach solutions apart
Multiple cameras at key process points help keep operation under close control. The machines perform high definition (up to 5 megapixel) inspections without sacrificing speed. XY accuracy is below 5 microns, which is increasingly important as die and feature sizes continue to shrink.
Systems are equipped with automatic wafer change for up to 300 mm wafers and comply with SECS/GEM and MES interface standards. Operating costs are further reduced by inbuilt versatility. We label all our ADAT3 machines XF (eXtra Flexible), because they can perform, in various applications – reel-to-reel, strip-to-strip and other types of die attach/bond – simply by reconfiguring them. So, you don't need to buy another machine when your or your customer’s requirements change.
Click on one of the product types below to learn more.
ADAT3 XF DBSG Strip glue die bonder
At up to 60,000 uph, the ADAT3 XF DBSG Strip Glue die bonder is four times faster than any other die bonder available on the market. It handles leaded and leadless packages, flip or non-flip, and has a double head dispense writer and an optional heated shuttle for DAF/WBC applications.
ADAT3 XF DBS Strip die bonder
The ADAT3 XF DBS Strip die bonder is the only in-line strip-to-strip die bonder available on the market with a speed of up to 60,000 uph. It receives strips with pre-applied glue or solder paste directly as input from another machine, processes these strips, and feeds them to the next machine in the line.
ADAT3 XF DS Die sorter
The ADAT3 XF DS Die Sorter runs at 60,000 uph and is 20% faster than its nearest competitor for wafer-level CSP/micro-CSP chip-scale packages. It inspects all six die sides without any speed penalty.
HIGH VOLUME REEL-TO-REEL EUTECTIC DIE BONDER
The 48,000 uph ADAT3 XF DBRE Reel-to-reel Eutectic die bonder can handle all wafer map formats. Equipped with high-definition optics for small-to-medium discretes, it features die alignment, backside chipping, die-size measurement, and optional sidewall inspection (for flat collets).
HIGH VOLUME RFID INLAY DIE BONDER
The ADAT3 XF Tagliner cures RFID inlays in milliseconds instead of the seconds needed by competing equipment. At 48,000 uph it is 3x times faster than anything else on the market and with an accuracy of ≤9 µm it is 30% more accurate too. It also helps eliminate PET plastics for more sustainable RFID manufacturing.
ULTRA HIGH-SPEED FLIP CHIP MINI-LED DIE BONDER
At 70,000 uph, our ADAT3 XF PiXelect bonder is considerably faster than any other flip chip bonder on the market. Crucially, this speed is achieved without compromising accuracy, which stays within 3 microns. Ready for next-generation LED displays, it handles the smallest available LEDs – down to 3x5 mil.