![](/.imaging/mte/itec/card/dam/itec/images/solutions/optical-inspection/post-dicing-wafer-aoi/Minimizing-waste-and-loss-in-the-wafer-dicing-procces.png/jcr:content/Minimizing%20waste%20and%20loss%20in%20the%20wafer%20dicing%20procces.png)
PHIXEL WIF
The PHIXEL WIF post-dicing AOI Wafer Inspection Frame system eliminates wafer damage due to dicing issues. It also inspects after package singulation of DFN (Dual Flat No-leads). The machine works at 60 slice wafers per hour and enables quick conversion for 6", 8", and 12" film carrier cassettes.
![](/.imaging/mte/itec/card/dam/itec/images/solutions/optical-inspection/3d-post-wirebond-reel-to-reel-inspection/The-only-3D-inspection-solution-in-the-market-for-reel-to-reel-products.png/jcr:content/The%20only%203D%20inspection%20solution%20in%20the%20market%20for%20reel-to-reel%20products.png)
PHIXEL DWR
The PHIXEL DWR Die bond Wire bond Reel-to-reel system is the only 3D 3rd Optical inspection system for reel-to-reel products. It performs high-speed (up to 150,000 UPH) multi-row 3D lead-frame inspection. That guarantees the quality of die and wire bond, with automatic high-speed laser treatment for rejects.
![](/.imaging/mte/itec/card/dam/itec/images/solutions/optical-inspection/strip-to-strip-inspection-after-planting/enables-early-detection-of-production-problems-t-prevent-loss.png/jcr:content/enables%20early%20detection%20of%20production%20problems%20t%20prevent%20loss.png)
PHIXEL MIS
The PHIXEL MIS performs ultra-high-speed Mid-end Inspection Strip-to-strip inspection after plating to guarantee product quality. Throughput is up to 117,000 UPH depending on test/package size. It also works with the largest (100x300 mm) strip size.
![](/.imaging/mte/itec/card/dam/itec/images/solutions/optical-inspection/optical-inspection-for-contact-contactless-module/The-only-equipment-on-the-market-providing-full-epassport.jpg/jcr:content/The%20only%20equipment%20on%20the%20market%20providing%20full%20epassport.jpg)
PHIXEL CMR
The PHIXEL CMR for Contact and Contactless Modules Reel-to-reel is the only equipment on the market capable of performing full inspection of ePassport, bankcard, and e-ID chipset modules. It has ultra-high-speed (70,000 UPH) 2D top & bottom side vision inspection with high-speed automatic reject removal.
![](/.imaging/mte/itec/card/dam/itec/images/solutions/optical-inspection/post-seal-in-tape-inspection/The-only-post-tape-inspection-equipment-on-the-market.jpg/jcr:content/The%20only%20post-tape%20inspection%20equipment%20on%20the%20market.jpg)
PHIXEL IHW
The PHIXEL IHW In-tape inspection Handler for Wide tape is the only post-tape inspection equipment providing full top & bottom side inspection. Working at up to 120,000 UPH, the carrier tape reel is convertible from 7 to 13-inch diameter, with auto conversion for different carrier tape widths up to 32 mm.