The PHIXEL WIF post-dicing AOI Wafer Inspection Frame system eliminates wafer damage due to dicing issues. It also inspects after package singulation of DFN (Dual Flat No-leads). The machine works at 60 slice wafers per hour and enables quick conversion for 6", 8", and 12" film carrier cassettes.
The PHIXEL DWR Die bond Wire bond Reel-to-reel system is the only 3D 3rd Optical inspection system for reel-to-reel products. It performs high-speed (up to 150,000 UPH) multi-row 3D lead-frame inspection. That guarantees the quality of die and wire bond, with automatic high-speed laser treatment for rejects.
The PHIXEL MIS performs ultra-high-speed Mid-end Inspection Strip-to-strip inspection after plating to guarantee product quality. Throughput is up to 117,000 UPH depending on test/package size. It also works with the largest (100x300 mm) strip size.
The PHIXEL CMR for Contact and Contactless Modules Reel-to-reel is the only equipment on the market capable of performing full inspection of ePassport, bankcard, and e-ID chipset modules. It has ultra-high-speed (70,000 UPH) 2D top & bottom side vision inspection with high-speed automatic reject removal.
The PHIXEL IHW In-tape inspection Handler for Wide tape is the only post-tape inspection equipment providing full top & bottom side inspection. Working at up to 120,000 UPH, the carrier tape reel is convertible from 7 to 13-inch diameter, with auto conversion for different carrier tape widths up to 32 mm.