ADAT3 XF DBSG

Up to 72.000 units per hour

Eliminate the trade-off between quality and productivity with high-definition inspection on front and backside executed on the fly without any speed penalty. At three times faster than anything on the market, this is the industry’s leading strip-to-strip die bonder for leaded or leadless packages with glue or DAF applications. The ADAT3 XF DBSG can place 1200 dies per minute, same as 20 dies per second, using a reversed pick up process, plus is capable of handling dies as small as 0.15 x 0.15 mm.