ADAT3 XF DBSG

Up to 60.000 units per hour

Eliminate the trade-off between quality and productivity with high-definition inspection executed on the fly without any speed penalty. At four times faster than anything on the market, this is the industry’s leading strip-to-strip die bonder for leaded or leadless packages with glue or DAF/WBC applications. The ADAT3 XF DBSG eliminates manual wafer change and speed drop, plus is capable of handling die as small as 0.2 x 0.2 mm.