PHIXEL WIF

Minimize waste and loss in the wafer dicing process

The most cost-efficient diced-wafer inspection system on the market. With ultra-high-speed vision scan and high-precision wafer 2D inspection, the Post Dicing Wafer AOI enables conversion for 6", 8", and 12" wafer frame film carrier cassette. It guarantees the quality of diced wafer, allows a fast feedback loop, and prevents wafer yield loss. When cost and quality of manufacturing are a concern, this diced-wafer inspection system offers a tight wafer supply to eliminate wafer damage due to dicing issues. WIF offers inspection after wafer dicing to detect surface defects or inspection after package singulation of DFN to detect package, mark, lead, and plating defects. Advanced Defect Classification (ADC) by hybrid analysis will enhance manufacturing efficiency and competitiveness.