Die Attach > mini-LED

ADAT3 PiXelect


Ready for next-generation LED direct view displays

Reduce your total cost of ownership. Gain quality inspections and the flexibility to scale — without compromising on accuracy, quality, or speed. The ADAT3 XF PiXelect Bonder is four times faster than anything on the market — handling LED as small as 3x5 mil. The flip-chip bin-mixing technology eliminates the sorting step and manual wafer change. Multiple systems can be connected — enabling you to build competitive, high-definition, and cost-effective displays using mini-LED technology.