Revolutionary flip-chip die bonder assembles 60,000 chips/hour
Flip chips have two key benefits over the wire-bonded chips they replace. They eliminate the quality problems associated with wire bonds, and so increase reliability. And they boost high-frequency performance by using copper pillars with much lower resistance than thin bond wires. Flip-chip die bonders have however been slow, so you need a massive investment in multiple machines for any sort of production volume. That is no longer a limitation.
Our new ADAT3 XF TwinRevolve flip-chip die bonder assembles up to 60,000 flip chips per hour, which is at least five times faster than anything else on the market. The new Flagship machine is a game changer, offering a fraction of the Total Cost of Ownership (TCoO) of previous die bonders. You get the same production from a fifth of the factory floor space, and you save on maintenance, operator hours, spare parts and energy costs. It will open a whole new range of applications to flip chips.
The new die bonder simplifies the assembly process. Twin rotating heads mean less inertia and vibration than the conventional forwards-and-backwards motion. The die is flipped and placed in a fast, smooth action with the same accuracy but at much higher speeds. And – as with the whole ADAT3 XF (eXtended Flexibility) family – the machine is automated, modular and field upgradable for extended lifetime and even more sustainable operation.
Performance
Up to 60,000 units per hour
Supports 8 to 12 inches wafer on frame film carrier
Strip size
100 x 300 mm
Die size
Minimal: 0.2 x 0.2 mm
Maximum: 3 x 3 mm
Proven flux screenprint solution available on request
4 cassettes at output (optional at input autoloader)
Full die traceability (strip E142 – wafer)
Auto recipe download (MES interface)
SECS/GEM interface with E142
QFN, DFN, HVQFN, SOT, SO, TSSOP, LGA leadless and leaded packages
Length, width: 0.2 x 0.2 mm to 3 x 3 mm
Aspect Ratio: 1:1 - 1:3
Thickness: 50-400 μm
Minimum length, width: 100 x 40 mm
Maximum length, width: 300 x 100 mm
Thickness: 0.1-1.0 mm
Small die (< 1 mm): XY: 1 σ xy ≤ 4 μm Rotation: 1 σ φ < 1˚
Large die (> 1 mm): XY: 1 σ xy ≤ 4 μm Rotation: 1 σ φ ≤ 0.15˚
Pick and place force: 0.2 - 1.5 ± 0.1 N
Vespel tip
Rubber tip
Push-up needle
Wafer size: 6-12 inches
Wafer frame: 8-12 inches
Steel/Plastic Film Frame Carrier (FFC)
Foil Tension: Programmable expander (8 inches: 1-10 mm; 12 inches: 1-15 mm)
Automatic wafer change and expander
Automatic barcode reader
Twin cross flux dispense module, volumetric dispense
Dot/Cross size, resolution: ≥ 120um 1 σ 20 μm
Dot position: 1 σ < 20 μm
Uph dispense depends on IO-count
Program mode: fast programming for common reject criteria
Reject treatment: strip map (E142) and reject bin
Inspection view: 5 cameras: (1) glue, (2) pre-pick, (3) back, (4) top, (5) post-bond
Length, width, height: 3000 x 2100 x 1250 mm³ (without magazine loader)
Length, width, height: 3500 x 2100 x 1250 mm3 (with magazine loader)
Net weight: 3000 kg (without magazine loader)
Net weight: 3300 kg (with magazine loader)