Die Attach > Die Bonder / Die Sorter

ADAT3 XF DS

DIE SORTER

Up to 60.000 units per hour

Gain maximum productivity at the lowest costs. At 20% faster than anything in the market, this is the die sorter for wafer-level CSP/micro CSP applications. It handles the smallest die with automatic wafer change. The ADAT3 XF DS also inspects all six sides of the die without any speed penalty, securing quality in this critical last process step — without compromising productivity or cost.